The vacuum process equipment SNT Sigma-V is a standard magnetron sputtering production equipment for processing large-area substrates in FPD and microelectronics.
Load-lock input provides increased productivity and process stability, making equipment be ready for clean room.
The size of the processed area is up to 310x420 mm. SNT Sigma-V is capable depositing uniform coatings on flat substrates of large dimensions. In the case of deposition on the substrate of 60*48 mm dimension loading capacity is 42 pieces.
The vertical arrangement of the substrates with a slope of 5-10 degrees provides low defect coatings, eliminates the shadow zone on the edge of the substrate, and simplifies the process of loading and unloading of substrates.
The standard complectation provides heating up to 350 degrees, ion-beam treatment, and deposition by 1-3 magnetrons.
Options to choose: an increase in the number of magnetrons up to 5, the replacement of ion-beam treatment by the RF plasma, robotic loading of cartridges.
- Maximal substrate size 300x420mm
- Maximal productivity:
d200 mm wafers 60 pcs / hour
d150 mm wafers 120 pcs / hour
d100 mm wafers 180 pcs / hour
- Thin wafers processing (automatic loading)
- Flexible system for metal, TCOs, ferromagnetic materials, and multilayer coatings deposition
- Small footprint